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Martin Lund

Executive Vice President

Common Hardware Group

Martin is Executive Vice President of the Common Hardware Group at Cisco. He leads the development and delivery of silicon, hardware systems, and optics that are integral to Cisco's AI, switching, routing, optical, and WiFi portfolios. Martin has a diverse and multifaceted background in the industry, and has led organizations across network systems, semiconductors and cloud communications software. He has a passion for empowering teams to deliver disruptive innovation and high-velocity execution. Prior to joining Cisco, Martin led Microsoft’s Azure for Operators organization, delivering Azure-based solutions encompassing 5G packet core, voice services, private 5G deployments, and AI-driven operations. He joined Microsoft through its acquisition of Metaswitch, a cloud native communications software company, where he served as CEO for five years. He was Senior Vice President and General Manager of Cadence Design Systems’ IP Group and spent 12 years at Broadcom, as Senior Vice President and General Manager of Network Switch Business. Under Martin’s leadership, that division evolved from its early stages to become a billion-dollar global franchise, offering merchant switch silicon for Cloud, Enterprise, Home, Automotive, and Service Providers. Earlier in his career, Martin held product and engineering management positions at Intel and Case Technology. He's also an accomplished innovator, holding more than 20 networking and communications-related patents. Beyond work, Martin, a Bay Area local with a thirst for adventure, explores the world. His passion extends to making a difference - he's committed to wildlife conservation, helping underprivileged communities, and championing equal education for children with dyslexia and other learning disabilities.

Articles

October 16, 2024

EXECUTIVE PLATFORM

Cisco Silicon One G200 AI/ML chip powers new systems for hyperscalers and enterprises

1 min read

Cisco Silicon One technology continues to offer the most customer choice and can be consumed in a variety of ways including silicon, hardware and full systems. Announcing two new solutions to support AI/ML buildouts across enterprise datacenters and hyperscalers.